X-FAB MEMS Foundry Itzehoe provides an unprecedented broad MEMS technology landscape. Next to standard MEMS processing MFI features a profound silicon and thick layer epi-silicon based surface micromachining technology enhanced by various ceramic and metallic materials. For actuators different piezoelectric materials like PZT and AlN are available. Wafer Level Packaging is the key technology for cost-efficient peripheral functionality like mechanical protection, hermetic housing or added optical system elements. X-FAB MEMS Foundry Itzehoe has excellent knowledge and capabilities to provide the optimum package solution on wafer scale for each MEMS application effecting in reduced device size, low production costs and high reliability at superior performance. Finally different Through Silicon Vias (TSV) technologies are completing modules to a seamless integrated MEMS process flow.

The MEMS production is based on a fully equipped class 10 MEMS clean room with a spacing of 1000 m². The wafer substrate size is 8 inch making the products also commercially attractive for low cost consumer application. For wafer finalisation a class 10.000 back end is available. The whole production control is steered and controlled by the manufacturing executive software PROMIS which includes also automated data acquisition and analysis for statistical process control (SPC). A highly qualified and motivated operating personnel secures a stable and continuous production flow.

X-FAB MEMS Foundry Itzehoe has extensive experience in process industrialization and transfer from prototype phase to volume production according to VDA 6.3 and ISO/TS 16949. Especially the implementation of SPC methods, continuous process improvement and yield management and the use of quality management tools like FMEA, control plan, control chart, fishbone diagram are among the core competences of X-FAB MEMS Foundry Itzehoe. In addition financial product and process calculation for production cost controlling are offered.